From 45°C Liquid Cooling to High-End Aluminium Materials

Metals-Tech Enables the Material Foundation of Next-Generation AI Computing Infrastructure

▍The AI infrastructure shift is also a materials shift

As large-scale AI models and GPU clusters expand rapidly, the performance bottleneck is shifting from chip supply to power delivery, thermal management, and advanced materials capability.

NVIDIA’s latest liquid-cooling architecture for AI infrastructure signals a clear industry trend: future AI data centers will be denser, run hotter, and depend increasingly on liquid cooling. Warm-water cooling at around 45°C enables AI factories to significantly reduce energy consumption and water usage while improving overall system efficiency.

Behind this transformation lies a growing demand for high-end aluminium materials—from cold plates, heat exchangers, and dry coolers to fin stock, structural components, and laminated foil for power electronics.

▍High-end aluminium: the material backbone of AI cooling

Warm-water liquid cooling relies on a complete material system that is lightweight, thermally efficient, and scalable:

• Heat exchanger materials – Fin stock, tubes, brazing sheets, and precision-formed components require excellent thickness accuracy, stable mechanical properties, high surface cleanliness, and reliable brazing performance.
• Cold plate and thermal management components – Aluminium is widely used in manifolds, covers, structural cooling parts, and auxiliary cold plates—demanding tight flatness, surface quality, corrosion resistance, and machining stability.
• Laminated foil for power electronics – AI computing also drives demand for intelligent power distribution. Solid-state transformers (SST) and power conversion systems rely on high-quality laminated foil—directly connecting aluminium foil rolling to AI infrastructure.

▍Metals-Tech: building quality into every step.

High-end aluminium materials cannot be created by final inspection alone. Quality must be designed, controlled, and verified across the entire production process.

Metals-Tech provides integrated Electrics, Automation, and Digital solutions across the full aluminium production chain:

• Hot rolling – Precision temperature control, rolling schedule optimization, gauge and profile management, and coiling control to establish a stable material foundation.
• Cold rolling – High-response AGC, automatic flatness control, mass flow control, tension optimization, laser speed measurement, edge plasticity improvement, and full-coil digital quality reporting.
• Foil rolling – Mass flow AGC, AFC, edge defect prevention, digital quality reporting, and adaptive process models to produce ultra-thin foil for high-end power electronics.

All systems are integrated through our Metals Intelligence digital platform, enabling real-time quality traceability from melt to final coil.

▍From rolling control to AI infrastructure.

The AI liquid-cooling revolution is creating a new demand structure for aluminium producers. Entering this market requires more than capacity—it demands stable quality, low defect rates, digital traceability, and the ability to continuously improve process performance.

Metals-Tech helps aluminium producers meet these requirements through systematic control optimization and digital quality management—connecting rolling-mill performance directly to AI computing infrastructure.

▍Conclusion:

NVIDIA’s 45°C full liquid-cooling architecture points the way forward: higher density, higher efficiency, lower water use, and smarter thermal management.

Aluminium will become one of the most scalable materials for AI data center infrastructure—from dry coolers and heat exchangers to fin stock, structural parts, and power-electronics systems.

Metals-Tech helps aluminium producers manufacture these high-end materials through full-process automation, digital quality management, and advanced process control.

From liquid cooling to electric power, from aluminium rolling to AI factories—Metals-Tech enables the material foundation of green, efficient, and intelligent computing infrastructure.

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